Development, validation, and application of semi-analytical interconnect models for efficient simulation of multilayer substrates [Elektronische Ressource] / von Renato Rimolo-Donadio

Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates Vom Promotionsausschuss der Technischen Universität Hamburg-Harburg zur Erlangung des akademischen Grades Doktor-Ingenieur (Dr.-Ing.) genehmigte Dissertation von Renato Rimolo-Donadio aus San José, Costa Rica 2010 1. Gutachter: Prof. Dr. sc. techn. Christian Schuster 2. Gutachter: Prof. Dr.-Ing. Arne Jacob 3. zusätzlicher Gutachter: Dr. Xiaoxiong Gu (IBM T. J. Watson Research Center, NY, USA) Vorsitzender des Promotionsverfahrens: Prof. Dr. Ernst Brinkmeyer Tag der mündlichen Prüfung: 17.12.2010 About the illustration: Urban Interconnects by R. Rimolo-Donadio, Acrylic on wood, 2002. Abstract This thesis deals with the efficient modeling and simulation of multilayer substrates in high-speed electronic systems, such as packages and printed circuit boards. Semi-analytical models for the electrical behavior of vias and traces are presented and a framework for automated simulation of multilayer structures is proposed. The models are devised in terms of microwave network parameters and they rely on the formulation of the parallel-plate impedance to describe wave propagation between adjacent reference planes. Via-to-plane capacitances are used to approximate the near fields around via barrels.