Power cycling capability of advanced packaging and interconnection technologies at high temperature swings [Elektronische Ressource] : / submitted by Raed Amro

Power cycling capability of advanced packaging and interconnection technologies at high temperature swings By the faculty of Electrical Engineering and Information Technology at Chemnitz university of Technology approved Dissertation In fulfilment of the requirements for the degree Doktor-Ingenieur (Dr.-Ing.) submitted by Dipl.-Ing. Raed Amro Born in 04.03.1969 in Dura-Hebron/ Palestine Date of submission: 24.04.2006 Examiners: Prof. Dr.- Ing. Josef Lutz Prof. Dr.- Ing. Andreas Lindemann Dr. Reinhold Bayerer Date of defence: 21.07.2006 Lastwechselfestigkeit von modernen Aufbau- und Verbindungstechniken bei hohen Temperaturhüben von der Fakultät für Elektrotechnik und Informationstechnik der Technischen Universität Chemnitz genehmigte Dissertation zur Erlangung des akademischen Grades Doktor-Ingenieur (Dr.-Ing.) Vorgelegt von Dipl. Ing. Raed Amro geboren am 04.03.1969 in Dura-Hebron/Palästina eingereicht am: 24.04.2006 Gutachter: Prof. Dr.- Ing. Josef Lutz Prof. Dr.- Ing. Andreas Lindemann Dr. Reinhold Bayerer Tag der Verleihung: 21.07.2006 Acknowledgement This work accrued during my employment as a scientific co-worker at the chair of Power Electronics and Electromagnetic Compatibility (PE/EMC) at Chemnitz university of technology/Germany. My special thanks go to Prof. Dr.-Ing.