Nanoscale characterization of epoxy interphase on copper microstructures [Elektronische Ressource] / vorgelegt von Jaeun Chung

Nanoscale Characterization of Epoxy Interphase on Copper Microstructures vorgelegt von Master of Engineering in Chemical Engineering und Master of Business Administration Jaeun Chung aus Korea Von der Fakultät III - Prozesswissenschaften der Technische Universität Berlin zur Erlangung des akademischen Grades Dokotor der Ingenieurwissenschaften - Dr.-Ing - genehmigte Dissertation Promotionsausschuss: Vorsitzender: Prof. Dr. rer. nat. W. Reimers Berichter: Prof. Dr.-Ing. M. H. Wagner Berichter: Dr. rer. nat. habil. E. Schulz Tag der wissenschaftliche Aussprache: 25. Januar 2006 Berlin 2006 D 83 “Nanoscale Characterization of Epoxy Interphase on Copper Microstructures” by Jaeun Chung /jae-woon jung/ Abstract The epoxy/metal interface regions are recognized as crucial for the mechanical reliability of composite materials. In particular, the spatial stress distribution is governed by modulus variations, which may result from the physical-chemical interactions between epoxy and the metal surface. The properties of the interphase between bulk polymer and metal were analyzed in nanometer scale. It was aimed to characterize the stiffness gradient of the polymeric interphase, which was formed by a thermoset being cured in contact with a metal surface.