3-D Interconnects Using Cu Wafer Bonding : Technology and Applications

• mémoire
• mémoire - matière potentielle : devices

3-D Interconnects Using Cu Wafer Bonding : Technology and Applications Rafael Reif, Chuan Seng Tan, Andy Fan, Kuan-Neng Chen, Shamik Das, and Nisha Checka Microsystems Technology Laboratories, Massachusetts Institute of Technology, 60 Vassar St., 39-625, Cambridge MA 02139, USA. () Abstract 3-D interconnects hold tremendous potential to reduce global interconnect latency and power dissipation.

• device layers
• k.n.chen
• k.c.saraswat
• chemical wet etch
• handle wafer
• chemical attack
• bonding
• r.
• cu