Frost & Sullivan: RFaxis' Single-chip/Single-die RF Front-end Solutions Offer the Best Possible Combination of Cost Effectiveness and Performance

Frost & Sullivan: RFaxis' Single-Frost & Sullivan: RFaxis' Single- chip/Single-die RF Front-end Solutions Offer the Best Possible Combination of Cost Effectiveness and Performance PR Newswire MOUNTAIN VIEW, California, Feb. 20, 2014 -- RFaxis' technology is helping wireless devices achieve performance and quality that is comparable to a wired network Based on its recent analysis of the market for radio frequency front-end module (RF FEM) solution for wireless communication, Frost & Sullivan recognizes RFaxis, Inc. with the 2014 North American Frost & Sullivan Award for Technology Innovation Leadership. RFaxis leveraged its intensely researched single-chip/single-die RF Front-end Integrated Circuit (RFeIC™) architecture to develop unique RF front-end solutions for wireless communications. These innovative solutions, which combine superior performance capabilities with affordability, also prove to be ideal alternatives to conventional gallium arsenide (GaAs) solutions. RF front-end solutions are traditionally built by embedding active and passive multiple components on a substrate using GaAs, a compound semiconductor material. The hybrid integration of passive and active compounds forms a multi-chip RF FEM, resulting in a large package size and bigger footprint on the printed circuit board (PCB).